AMD is preparing to roll out an update to its Extended Profiles for Overclocking (EXPO) technology, bringing it to version 1.2. While the update has yet to be officially released, references to the new version have already appeared in the HWiNFO v8.35-5890 beta. At present, the company uses EXPO 1.0 for its Ryzen processors, allowing memory overclocking profiles to be tuned for different configurations, improving overall system performance and delivering an optimal balance between latency and speed for Infinity Fabric.
For now, the exact improvements that EXPO 1.2 will introduce remain unclear. However, a Ryzen 7 9850X3D from the upcoming Ryzen 9000 X3D lineup was recently spotted running DDR5 memory at an impressive 9,800 MT/s, an outstanding figure for this class in the current Zen 5 cycle. This could point to potential memory‑profile optimizations we have yet to see, which may arrive toward the end of the X3D product lifecycle.
In addition, according to an AMD insider and author of popular tuning tools, EXPO 1.2 may add support for CUDIMMs—DDR5 modules with integrated clock‑driver circuitry. This innovation would improve signal integrity at high frequencies and allow DDR5 modules to surpass the speeds defined by JEDEC standards, though it is still unclear how exactly this will be implemented.
As a result, the EXPO 1.2 update could significantly boost interest in AMD’s products amid strong competition, giving users new ways to optimize their systems and squeeze out more performance. This, in turn, may impact the high‑performance CPU and memory market, further strengthening AMD’s position among other manufacturers.
